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300mm fab with two record heights to boom through 2023, SEMI report – Tech

Figure 1: 300mm fab equipment spend from 2013 to 2024

Chip industry to add 38 new 300mm fabs by 2024

MILPITAS, California, 3 November 2020 SEMI stated in its report that PRNewswire / – in 2020, 300mm fab investment will grow 13% year-over-year (YoY) in 2020, meeting the previous record high in 2018. 300mm fab outlook on 2024. The COVID-19 epidemic has increased the 2020 boom in fab spending by accelerating digital changes worldwide, and is expected to increase in 2021.

Demand for cloud services, servers, laptops, gaming and healthcare technology is increasing to boost growth. Fast-evolving technologies such as 5G, Internet of Things (IoT), automotive, artificial intelligence (AI) and machine learning that continue to fuel demand for greater connectivity, large data centers and big data are also behind the growth. Huh.

“The COVID-19 epidemic is accelerating a digital transformation that is imaginative in almost every industry to change the way we work and live,” Ajit Manocha, President and CEO of SEMI. “Anticipated record spending and 38 new Fabers reinforce the role of the semiconductor as it is the basis for leading technologies that are driving this change and promise to help solve some of the world’s biggest challenges.”

The growth in semiconductor fab investment will continue in 2021 but at a slower rate of 4% yo. Mirroring previous industry cycles, the report predicts a mild recession in 2022 and a more modest downturn in 2024 $ 70 billion Record high in 2023. See figure 1.

Adding 38 new 300mm fabs

Semi 300mm fab outlook on 2024 The chip industry suggests that at least 38 new 300mm volume fabs have been added from 2020 to 2024, a conservative projection that does not factor into low-probability or rumored fab projects. During the same period, the fab capacity will increase by about 1.8 million wafers to reach more than 7 million per month.

Under a high-probability project forecast, the industry will add at least 38 new 300mm volume fabs from 2019 to 2024. Taiwan Will add 11 quantity fabs and China Eight accounts for half of the total. The chip industry will command 161 300 mm volume fab by 2024.

Capacity and expenditure growth by sector

China Will rapidly increase its global share from 20% in 2015 to 8% in 2024, reaching 1.5 million 300 mm wpm in the final year of the reporting period. Although non-Chinese companies will account for a large portion of that growth, Chinese-owned organizations are accelerating their capacity investment. These companies will represent around 43% Of china Fab capacity is expected to reach 50% by 2022 and 60% by 2024.

Of japan The share of 300 mm installed capacity has decreased from 19% in 2015 to 12% in 2024. The US stock has also fallen from 13% in 2015 to an estimated 10% in 2024.

The biggest regional spenders will be Korea, with investment between US $ 15 billion And US $ 19 billion, after Taiwan, Which will interrupt US $ 14 billion And US $ 17 billion In 300mm fabs, and then China, in between US $ 11 billion And $ 13 billion In investment.

Low spending areas will see the largest increase in investment between 2020 and 2024. Will lead the pack with an impressive 164% growth in Europe / Middle East, followed by Southeast Asia 59%, America at 35%, and Japan At 20%.

Growth in product sector growth

Memory accounts for an increase in 300mm fab spending. Real and forecast investments show steady growth in the upper single digits for each year from 2020 to 2023, with a strong 10% growth in stores for 2024.

The contribution of DRAM and 3D NAND to 300mm fab spending will be uneven from 2020 to 2024. The investment for Logic / MPU, however, will see steady improvement from 2021 to 2023. The power-related device will be the standout area in 300mm fab investments, but a 200% increase in 2021 and double-digit growth in 2022 and 2023.

286 fab and lines tracking from 2013 to 2024 300mm fab outlook on 2024 247 updates since publication of 104 Fabs, nine new fab and line listings, and two cancellations March 2020 Report good.

About SEMI

Semi® Electronics combines more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of design and manufacturing. SEMI members are responsible for innovations in materials, design, equipment, software, equipment and services, enabling smarter, faster, more powerful and more affordable electronic products. The Electronic System Design Alliance (ESD Alliance), FlexTech, Fab Owners Alliance (FOA) and MEMS & Sensor Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI that focus on specific technologies. go to www.semi.org To learn more, contact one of our worldwide offices, and connect with SEMI Linkedin And Twitter.

Union contact

Michael hall/ Semi
Phone: 1.408.943.7988
E-mail: [email protected]

Christian Ji. Dieselndorf/ Semi
Phone: 1.408.943.7940
E-mail: [email protected]

SEMI® connects 2,000+ member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing.  SEMI members are responsible for innovations in materials, design, equipment, software, equipment and services, enabling smarter, faster, more powerful and more affordable electronic products.  SEMI builds connections that help its members prosper, create new markets, and address common industry challenges simultaneously.  Go to http://www.semi.org

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