ERS will present its new automated panel debonding technology for electronic semiconductor packaging technology at China’s largest technology conference – decoding

Business Wire India

ERS Electronic, the leader of innovation in thermal management solutions for the semiconductor industry, is exhibiting and presenting for the first time at CSPT (China Semiconductor Packaging and Test Market and Technology Annual Conference). Conference, which takes place from 8Th From 10Th November in Tianshui will be attended by some of the major players in the semiconductor manufacturing industry, including ASE Group, JCET Group and Tongfu Microelectronics Co., Ltd. (TFME).

In 2008, ERS launched its first thermal debut and warpage correction tool for fan-out advanced packaging applications, leveraging its decades of experience in temperature wafer probing. Since then, the company has continued to innovate in the fan-out space by supporting different wafer formats and panels.

Two years ago, ERS announced the MPDM700, a manual thermal debonding machine for panels up to 650 mm x 550 mm, which enabled further research and development of advanced packaging technologies. The machine eliminates any handling-induced warpage during debonding, and can also reduce the overall warpage of 4 mm down for ERS’s patented Tritemp® slide. An automated version of the machine, called the APDM700, is currently under development with a Chinese lead customer. Joshua Zhou, Director of Sales and Marketing, ERS Greater China, will reveal some key features of the machine’s architecture and the technology of ERS during its CSPT presentation ahead of its expected release early next year.

“CSPT has a deep impact on the Chinese semiconductor industry and is an invaluable opportunity for us to learn more about the emerging advanced packaging market in China,” says Debbie-Claire Sanchez, ERS’s fan-out equipment business unit manager.

“We look forward to interacting with our industry peers and sharing with them our latest innovations in the fan-out space”, says Joshua Zhou.

“ERS Electronic GmbH – an eminent German semiconductor company with 10 years of experience in advanced packaging equipment,” says Xi Yueru, marketing director of CSPT. “We are excited to offer attendees the opportunity to learn more about the state-of-the-art technology of ERS, which can help drive the growth of the Chinese semiconductor industry.”

About ERS:

ERS Electronic GmbH, based around Munich, has been producing innovative thermal testing solutions for the industry for nearly 50 years. The company has gained an excellent reputation in the field, with its fast and accurate air-cooled thermal chuck for testing temperatures ranging from –65 ° C to + 550 ° C, particularly for analytical, parameter-related and manufacturing tests. With systems. Today, ER3-developed thermal chuck systems such as AC3, AirCool® PRIME, AirCool® and PowerSense® are all integral in the large-size wafer progression in the semiconductor industry.

for more information please visit: www.ers-gmbh.com

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